Image Source: MediaTek
MediaTek has unveiled two new chips designed for mid-range smartphones, the Dimensity 7300 and 7300X. What are their specifications and key features?
Dimensity 7300
| Specification | Description |
|---|---|
| CPU | Octa-core with 4x ARM Cortex-A78 cores (up to 2.5GHz) and 4x Cortex-A55 cores |
| Process | 4nm process technology |
| Power Consumption | 25% lower on A78 cores compared to Dimensity 7050 |
| GPU | Mali-G615 with MediaTek HyperEngine optimization |
| Performance | Up to 20% increased FPS and energy savings compared to competitors |
| Photography | MediaTek Imagiq 950 with 12-bit HDR ISP, support for up to 200MP cameras |
| AI Efficiency | APU 655, double the performance of Dimensity 7050 |
| 5G Technology | MediaTek 5G UltraSave 3.0+ with power-saving enhancements |
| 5G Speeds | Up to 3.27Gb/s download through 3CC carrier aggregation |
| Wi-Fi Support | Tri-band Wi-Fi 6E |
| Dual SIM | Dual 5G SIM support with dual VoNR |
Dimensity 7300X
| Feature | Description |
|---|---|
| Designed For | Flip-style foldable devices, supporting dual-screen usage |
According to MediaTek, the Dimensity 7300 enables seamless multitasking, superior photography, enhanced gaming performance, and improved AI-based computation. Meanwhile, the Dimensity 7300X is tailored for flip-style foldable devices, supporting dual-screen usage.
Both chips feature an octa-core CPU consisting of four ARM Cortex-A78 cores clocked at up to 2.5GHz, and four Cortex-A55 cores. This 4nm process is said to result in 25% lower power consumption on the A78 cores compared to the Dimensity 7050.
The GPU is the Mali-G615 optimized using MediaTek HyperEngine. MediaTek claims that this CPU and GPU combination provides up to 20% increased FPS and energy savings compared to competitors.
"The MediaTek Dimensity 7300 series of chips will be crucial in integrating the latest AI enhancements and connectivity features, enabling manufacturers to deliver smooth streaming and gaming experiences," said Dr. Yenchi Lee, Vice General Manager of MediaTek Wireless Communications Business.
"Furthermore, the Dimensity 7300X allows OEMs to explore new innovative form factors with support for dual screens," he added.
The Dimensity 7300 chip also offers enhanced photography capabilities with the MediaTek Imagiq 950 featuring a premium-class 12-bit HDR ISP and support for up to 200MP main cameras. The APU 655 is said to significantly enhance AI task efficiency, delivering double the performance of the Dimensity 7050.
Other key features of the Dimensity 7300 and Dimensity 7300X include:
- MediaTek 5G UltraSave 3.0+ technology, incorporating a range of power-saving enhancements from R16 along with MediaTek's own optimizations, providing up to 13-30% greater power savings compared to competitors in general 5G sub-6GHz connectivity scenarios.
- Support for 5G download speeds up to 3.27Gb/s through 3CC carrier aggregation, enabling faster download speeds in urban and suburban areas.
- Tri-band Wi-Fi 6E support for fast and reliable multi-gigabit wireless connectivity.
- Dual 5G SIM support with dual VoNR to offer more choices to users.
MediaTek's Dimensity 7300 and 7300X chips bring a performance, efficiency, and connectivity features to enhance the user experience in mid-range smartphones and foldable devices.
